Documents publiés en "2014"

Taringou, F., Bornemann, J., Wu, K., & Weiland, T. (juin 2014). Broadband interconnects between coplanar waveguide and substrate integrated waveguide for dense packaging and integration [Communication écrite]. IEEE MTT-S International Microwave Symposium (IMS 2014), Tampa Bay, Florida, USA. Lien externe