Documents publiés en "2011"

Département de génie électrique

Ding, Y., Kwark, Y. H., Shan, L., Baks, C., & Wu, K. (mai 2011). Techniques for de-embedding a high port count connector to PCB via interposer [Communication écrite]. 61st Electronic Components and Technology Conference (ECTC 2011), Lake Buena Vista, FL, United states. Lien externe