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Popovici, D., Sapieha, J.-E., Czeremuszkin, G., Alptekin, A., Martinu, L., Meunier, M., & Sacher, E. The deposition of copper onto Teflon AF1600: an XPS comparison of vapor deposition and sputtering [Paper]. Metallized Plastics 5 & 6: Fundamental and Applied Aspects. (5th Conference held May 5-19, 1996 in Los Angeles and the 6th Conference held Aug. 31-Sept. 5, 1997 in Paris). External link
Alptekin, A., Sacher, E., Czeremuszkin, G., Martinu, L., Meunier, M., DiRenzo, M., Drzal, L. T., & Schreiber, H. P. (1997, February). Copper adhesion to fluoropolymers [Paper]. 20th Annual Anniversary Meeting of the Adhesion Society, Hilton Head Island, S.C.. Unavailable
Alptekin, A., Sacher, E., Czerernuszkin, G., Martinu, L., & DiRenzo, M. (1997, May). Dielectric and mechanical properties of copper/fluoropolymer film structures [Paper]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec. Unavailable
Alptekin, A., Czeremuszkin, G., Martinu, L., Meunier, M., Sacher, E., & DiRenzo, M. (1996, December). Mechanical and dielectric properties of low permittivity dielectric materials [Paper]. MRS Fall Meeting, Boston, MA, USA. External link
Czeremuszkin, G., Martinu, L., Alptekin, A., Popovici, D., & Sacher, E. (1997, May). Thermal stability of low permittivity fluoropolymer dielectrics [Paper]. 2nd International Symposium on Low and High Dielectric Constant Materials: Materials Science, Processing, and Reliability Issues, Montréal, Québec. Unavailable