Rapid thermal annealing for reducing stress in tungsten x-ray mask absorber

Y. Diawara, H. Lafontaine, Mohamed Chaker, J. C. Kieffer, H. Pépin, R. W. Cochrane, John F. Currie, Anne-Marie Haghiri-Gosnet, M. F. Ravet et F. Rousseaux

Article de revue (1993)

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Département:	Département de génie physique
URL de PolyPublie:	https://publications.polymtl.ca/82250/
Titre de la revue:	Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena (vol. 11, no 2)
Maison d'édition:	American Institute of Physics
DOI:	10.1116/1.586673
URL officielle:	https://doi.org/10.1116/1.586673
Date du dépôt:	15 sept. 2026 15:37
Dernière modification:	15 sept. 2026 15:37

Citer en APA 7:

Diawara, Y., Lafontaine, H., Chaker, M., Kieffer, J. C., Pépin, H., Cochrane, R. W., Currie, J. F., Haghiri-Gosnet, A.-M., Ravet, M. F., & Rousseaux, F. (1993). Rapid thermal annealing for reducing stress in tungsten x-ray mask absorber. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena, 11(2), 296-300. https://doi.org/10.1116/1.586673

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