Electrically conductive ink for solvent-cast 3D printing

Daniel Therriault and Kambiz Chizari

Patent Application (2018)

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Department:	Department of Mechanical Engineering
PolyPublie URL:	https://publications.polymtl.ca/39983/
Publisher:	Polyvalor
Official URL:	https://patents.google.com/patent/US20180022023
Date Deposited:	18 Apr 2023 15:03
Last Modified:	25 Sep 2024 16:25

Cite in APA 7:	Therriault, D., & Chizari, K. (2018). Electrically conductive ink for solvent-cast 3D printing. (Patent Application no. US20180022023). https://patents.google.com/patent/US20180022023
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