Microstructural evolution, mechanical properties, and strain hardening behavior of ultrafine grained commercial pure copper during the accumulative roll bonding process

A. Fattah-alhosseini, O. Imantalab, Y. Mazaheri et Mohsen Khorasgani Keshavarz

Article de revue (2016)

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Département:	Département de génie physique
URL de PolyPublie:	https://publications.polymtl.ca/34855/
Titre de la revue:	Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing (vol. 650)
Maison d'édition:	Elsevier
DOI:	10.1016/j.msea.2015.10.043
URL officielle:	https://doi.org/10.1016/j.msea.2015.10.043
Date du dépôt:	18 avr. 2023 15:05
Dernière modification:	05 avr. 2024 11:26

Citer en APA 7:	Fattah-alhosseini, A., Imantalab, O., Mazaheri, Y., & Keshavarz, M. K. (2016). Microstructural evolution, mechanical properties, and strain hardening behavior of ultrafine grained commercial pure copper during the accumulative roll bonding process. Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing, 650, 8-14. https://doi.org/10.1016/j.msea.2015.10.043

Citer en APA 7:

Fattah-alhosseini, A., Imantalab, O., Mazaheri, Y., & Keshavarz, M. K. (2016). Microstructural evolution, mechanical properties, and strain hardening behavior of ultrafine grained commercial pure copper during the accumulative roll bonding process. Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing, 650, 8-14. https://doi.org/10.1016/j.msea.2015.10.043

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