Article (1997)
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| Department: | Department of Mechanical Engineering |
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| PolyPublie URL: | https://publications.polymtl.ca/30482/ |
| Journal Title: | Journal of Thermoplastic Composite Materials (vol. 10, no. 5) |
| Publisher: | Sage Publications |
| DOI: | 10.1177/089270579701000501 |
| Official URL: | https://doi.org/10.1177/089270579701000501 |
| Date Deposited: | 18 Apr 2023 15:23 |
| Last Modified: | 08 Apr 2025 02:21 |
| Cite in APA 7: | Fisa, B., & Gundjian, M. (1997). Factors affecting adhesion at copper-polyamide 11 andaluminum-polyamide 11 interfaces. Journal of Thermoplastic Composite Materials, 10(5), 416-434. https://doi.org/10.1177/089270579701000501 |
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